ReportsMonitor.com has added Global Underfill Market Research Report 2017 to its database of market research reports.

This report studies the Underfill market status and outlook of global and major regions, from angles of manufacturers, regions, product types and end industries; this report analyzes the top manufacturers in global and major regions, and splits the Underfill market by product type and applications/end industries.

The Global Underfill market size was 367.71 million USD in 2016 and it will be 454.71 million USD in 2022, with a CAGR 3.60% from 2016 to 2022.

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The major players in global Underfill market include

Henkel

WON CHEMICAL

NAMICS

SUNSTAR

Hitachi Chemical

Fuji

Shin-Etsu Chemical

Bondline

AIM Solder

Zymet

Panacol-Elosol

Master Bond

DOVER

Darbond

HIGHTITE

U-bond

 

Figure Global Market Size (Million USD) Status and Outlook 2012-2022

Source: Annual Reports, Secondary Information, Press Releases, Expert Interviews and QYResearch, July 2017

 

Geographically, this report is segmented into several key Regions, with output/production, consumption, revenue, market share and growth rate of Underfill in these regions, from 2012 to 2022 (forecast), covering

North America

EU

China

Japan

South Korea

Taiwan

Other regions

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Table Global Underfill Revenue (Million USD) Comparison by Regions (2012-2022)

Regions                2012       2016       2022       CAGR

(2016-2022)

North America  159.67   191.74   237.13   3.60%

EU          46           57.6        78.48     5.29%

China     19.68     23.27     29           3.74%

Japan    35.05     41.06     47.71     2.53%

South Korea       5.1          6.57        8              3.34%

Taiwan  5.74        6.4          7.95        3.68%

ROW      36.69     41.07     45.44     1.70%

Source: Annual Reports, Secondary Information, Press Releases, Expert Interviews and QYResearch, July 2017

 

On the basis of product, the Underfill market is primarily split into

Semiconductor Underfills

Board Level Underfills

 

Table Global Underfill Output/Production (K kg) and Growth Rate Market Split by Product Type

Market Segment by Type             2016       2017       2018       2019       2020       2021       2022

Semiconductor Underfills             168         182         195         208         222         235         249

-Change (%)       8.97%    8.41%    7.37%    6.56%    6.54%    6.14%    5.74%

Board Level Underfills    335         365         392         419         447         475         502

-Change (%)       8.43%    9.06%    7.40%    6.89%    6.59%    6.27%    5.77%

Total      502         547         587         627         668         710         751

-Change (%)       8.61%    8.84%    7.39%    6.78%    6.57%    6.23%    5.76%

Source: Secondary Literature, Press Releases, Expert Interviews and QYResearch, July 2017

 

On the basis on the end users/applications, this report covers

Industrial Electronics

Defense & Aerospace Electronics

Consumer Electronics

Automotive Electronics

Medical Electronics

Others

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Table Global Underfill Consumption (K kg) by Application (2016-2022)

2012       2016       2022       Market Share (%)2022   CAGR

(2016-2022)

Industrial Electronics      109.4     153.5     235.8     31.42%  7.42%

Defense & Aerospace Electronics             20.3        30.4        47.8        6.37%    7.83%

Consumer Electronics    122         182.3     271.8     36.22%  6.88%

Automotive Electronics 28.9        40.4        59.1        7.87%    6.55%

Medical Electronics         49.9        67.3        94.3        12.56%  5.78%

Others  20.1        28.3        41.7        5.56%    6.67%

 

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